发明名称 THERMOPLASTIC RESIN COMPOSITION
摘要 The thermoplastic resin is composed of 35-60 wt% polycarbonate resin with viscosity molecular weight 20,000-30,000, 35-55 wt% ABS resin, 5-10 wt% olefin resin, 0.3-1.0 wt% the mixture of thioester compound such as pentaerythritol tetrakis[3-(dodecylthio)-phosphate , bis(2,4-di-tertiary-butyl) pentaerythritol diphosphate or distearil pentaerythritol diphosphate, phosphate compound such as tris(2,4-di-tertiary-butylphenyl)-phosphate, bis(2,4-di-tertiary-butyl) pentaerythritol diphosphate or distearil pentaerythritol diphosphate and phenolic compound such as octadecyl 3,5-di-tertiary-butyl-4-hydroxy hydrosinamate, 2,5-di-tertiary-butyl-4-secondary-butylphenol or 2,6-di-tertiary-butyl-4-methylphenol as an antioxidant, 0.2-0.8 wt% dimethyl silicon oil as a releasing agent.
申请公布号 KR970000095(B1) 申请公布日期 1997.01.04
申请号 KR19920015371 申请日期 1992.08.26
申请人 SAMYANG CO.,LTD. 发明人 PARK, JOON-KYUNG;LEE, HO-ILL;SONG, JAE-HO
分类号 C08L55/02;C08L69/00;(IPC1-7):C08L69/00 主分类号 C08L55/02
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