MANUFACTURING METHOD OF HYBRID IC BOARD

摘要

a conductor-forming step having a plasticizing after printing a conductor(12) on a ceramic substrate(11) to dry it; a resistor-forming step having the plasticizing after printing a resistor(13) to dry it; a protection film-forming step having the plasticizing after printing a protection film(14) to dry it; a resistor-trimming step trimming the resistance value of the resistor to a required value; and soldering the region where a lead frame of the conductor is soldered and the pattern region the conductor.