| 摘要 |
<p>PURPOSE: To lessen the adhesion of particles to a board, and to improve the yield of production of a semiconductor manufacturing device. CONSTITUTION: The title board conveying jig is made of tabular material and a sheet of board can be housed therein, a board inserting inlet 1, with which a board is taken out or taken in by moving it horizontally, is provided on the side face of the board, space where the arm of a semiconductor manufacturing device goes in and out is provided, an upper surface junction part 3 is formed on the upper part of outer circumference of the board, and a bottom face junction part 4, which is coincided with the protrusion of the upper surface junction part, is formed on the bottom face of outer circumference. A projection or a protruding part, which is coincided with the bottom face junction part 4 of the board conveying jig is provided on the loader part and the unloader part of the semiconductor manufacturing device, and an arm, with which the board is delivered between the board conveying jig and the semiconductor manufacturing device, is provided.</p> |
