发明名称 MANUFACTURE OF PACKAGE FOR HOUSING OF SEMICONDUCTOR CHIP
摘要 PROBLEM TO BE SOLVED: To obtain a package whose reliability is high when a connecting pad which is formed at the inside of a recessed part formed in the rear surface of an insulating substrate is brazed to, attached to, and mounted on, a ball- shaped terminal. SOLUTION: The brazing operation of a ball-shaped terminal 7 to a connecting pod 5a is performed at the steps (a) to (c) in the following. At the step (a), a brazing-material paste 9 which is formed by adding and mixing a flux to and with a brazing-material powder is fed into a recessed part 1b on the rear surface of an insulating substrate 1 in which a connecting pad 5a has been formed at the inside. At the process (b), the ball-shaped terminal 7 is formed of a brazing material, and the ball-shaped terminal 7 is placed on the recessed part 1b into which the brazing-material paste 9 has been fed. At the step (c), the brazing-material paste 9 and the ball-shaped terminal 7 are heated, and a brazing material in the brazing-material paste 9 and the ball-shaped terminal 7 are melted and integrated so as to be brazed and bonded to the connecting pad 5a.
申请公布号 JPH0951050(A) 申请公布日期 1997.02.18
申请号 JP19950199527 申请日期 1995.08.04
申请人 KYOCERA CORP 发明人 UEGAKI SHIYOUJI;SATO SHINGO
分类号 H01L23/12;H01L21/60;H05K3/34;H05K3/40;(IPC1-7):H01L23/12 主分类号 H01L23/12
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