发明名称 Semiconductor memory device and method of manufacturing semiconductor memory device and method of layouting auxiliary pattern
摘要 According to one embodiment, a semiconductor memory device includes a semiconductor substrate, which includes thereon a first region where memory elements are arranged and a second region where circuit elements driving the memory elements are arranged. The first region is provided with a stacked body including a plurality of metal films. Further, the stacked body is divided into a plurality of parts by first separation portions extending in a first direction. The second region is provided with an auxiliary pattern, which includes the stacked body together with a separation portion pair including a pair of second separation portions that divide the stacked body. The second separation portions extend in a second direction intersecting with the first direction.
申请公布号 US9455271(B1) 申请公布日期 2016.09.27
申请号 US201514965159 申请日期 2015.12.10
申请人 Kabushiki Kaisha Toshiba 发明人 Setta Yuji
分类号 H01L29/792;H01L27/115;H01L23/00;H01L27/02;G06F17/50 主分类号 H01L29/792
代理机构 Oblon, McClelland, Maier & Neustadt, L.L.P 代理人 Oblon, McClelland, Maier & Neustadt, L.L.P
主权项 1. A semiconductor memory device comprising a semiconductor substrate, which includes thereon a first region where memory elements are arranged and a second region where circuit elements driving the memory elements are arranged, wherein the first region is provided with a stacked body including a plurality of metal films, the stacked body being divided into a plurality of parts by first separation portions extending in a first direction, and the second region is provided with an auxiliary pattern, which includes the stacked body together with a separation portion pair including a pair of second separation portions that divide the stacked body, the second separation portions extending in a second direction intersecting with the first direction.
地址 Minato-ku JP