发明名称 Distributed decoupling capacitor
摘要 An electrical device including a plurality of fin structures. The plurality of fin structures including at least one decoupling fin and at least one semiconductor fin. The electrical device includes at least one semiconductor device including a channel region present in the at least one semiconductor fin, a gate structure present on the channel region of the at least one semiconductor fin, and source and drain regions present on source and drain region portion of the at least one semiconductor fin. The electrical device includes at least one decoupling capacitor including the decoupling fin structure as a first electrode of the decoupling capacitor, a node dielectric layer and a second electrode provided by the metal contact to the source and drain regions of the semiconductor fin structures. The decoupling capacitor is present underlying the power line to the semiconductor fin structures.
申请公布号 US9455250(B1) 申请公布日期 2016.09.27
申请号 US201514788092 申请日期 2015.06.30
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 Cheng Kangguo;Khakifirooz Ali;Lu Darsen D.;Shahidi Ghavam G.
分类号 H01L21/02;H01L27/06;H01L29/78;H01L29/94;H01L27/108;H01L23/528;H01L27/092;H01L29/66;H01L49/02;H01L23/522;H01L21/8238;H01L21/768 主分类号 H01L21/02
代理机构 Tutunjian & Bitetto, P.C. 代理人 Tutunjian & Bitetto, P.C. ;Alexanian Vazken
主权项 1. An electrical device comprising: a plurality of fin structures including at least one decoupling fin structure and at least one semiconductor fin structure; at least one semiconductor device including a channel region present in the at least one semiconductor fin structure, a gate structure present on the channel region of the at least one semiconductor fin structure, and source and drain regions present on source and drain region portions of the at least one semiconductor fin structure; and at least one decoupling capacitor including the at least one decoupling fin structure as a first electrode of the at least one decoupling capacitor, a node dielectric layer and a second electrode provided by a metal contact to the source and drain regions of the at least one semiconductor fin structure, wherein the decoupling capacitor is present underlying the power line to the at least one semiconductor fin structure.
地址 Armonk NY US