| 摘要 |
A lead frame of a semiconductor package is described that can prevent an incomplete moling and internal void. In the middle of side rails 1, 1', tie bars 3, 3' support a paddle 2 in which a semiconductor chip is attached and then fixed. The semiconductor chip is wire-bonded to a plurality of leads 4, 4' at each side of the paddle 2 which are supported by dam bars 5, 5' connected between the side rails 1, 1'. A baffle 10 is formed in one body so that it control the flow of plastic resin, put into the runner gate of a metal mold, to be constant when the molding is progressed. Thereby, it is possible to reduce the flowing velocity of the plastic resin at the place close to the runner gate, and thus prevent the incomplete moling and internal void from being generated due to the flowing difference of the plastic resin. |
