BOARD COOLING TEST DEVICE

摘要

The present invention relates to a board cooling test system used to solve heat emission caused by an increase in the heat emission density per unit area of integrated communication system. This board cooling test system includes a coupling means (16) with curved surface fixing a guide pin (17) on a bracket (15)'s other end and pulling a rod cell under the guidance of the guide pin (17) by turning a handle (18); left and right compression plates (7, 8) fixed to the left and right sides of a main plate (9) via a connecting bar (13) and supported by a guide bearing (12) and a support roller (19); a hinge means with a curved surface making support plates (3, 3') and heat insulation plates (4, 4') contact the plate (7) and the main plate (9).