发明名称 |
THIN FILM WIRING SHEET, MULTILAYER WIRING BOARD AND THEIR PRODUCTION |
摘要 |
PROBLEM TO BE SOLVED: To suppress the curling by providing the wiring layers on the opposite sides and arranging an adhesive layer of polymer material and a low thermal expansion layer of polymer material symmetrically in the vertical direction. SOLUTION: A low thermal expansion polyimide precursor solution is applied onto the surface of a copper foil 102 and heated. An adhesive polyimide precursor solution is then applied thereon and heated. It is then imidized to obtain a first insulation layer 11 comprising a first low thermal expansion polyimide layer 103 and a first adhesive polyimide layer 104. Subsequently, a through hole 105 is filled with copper by electrolytic copper plating thus forming a first via wiring 115. A copper plating layer 106 is then etched to form a first wiring pattern 107. Similarly, a second insulation layer 12 is formed on a second pattern 109 and a via wiring 116 is obtained by electroless plating while a third wiring pattern 134 is obtained by etching. With such a method, a high density high performance multilayer wiring board can be produced at high yield without taking many days. |
申请公布号 |
JPH0955568(A) |
申请公布日期 |
1997.02.25 |
申请号 |
JP19950205991 |
申请日期 |
1995.08.11 |
申请人 |
HITACHI LTD |
发明人 |
SHOJI FUSAJI;TOGAWA HIDEO |
分类号 |
C09J7/02;C09J179/08;H05K1/00;H05K1/03;H05K1/11;H05K3/46;(IPC1-7):H05K1/11 |
主分类号 |
C09J7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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