JIG FOR SURFACE TREATING SEMICONDUCTOR

摘要

PROBLEM TO BE SOLVED: To secure semiconductor laser wafers cleaved into bars and spacers alternately onto a plate having a window in order to form an optical membrane easily on the edge of semiconductor laser wafer without causing any damage. SOLUTION: In the jig for surface treating a semiconductor, semiconductor laser wafers 5 cleaved into bars and spacers 6 are arranged alternately on the notched part 4 of a holding base 3 disposed at the window part 2 of a body 1. The semiconductor laser wafers 5 and spacers 6 are secured while being pressed by means of the holding base 3 and a securing jig 7. Subsequently, an optical membrane is formed on the end face of semiconductor wafer 5.