| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a PBGA semiconductor device, which is manufactured using a lead frame as its core material, can be manufactured more simply than a conventional PBGA semiconductor device manufactured using a heat-resistant organic substrate with circuits formed on both surfaces thereof, and has a good heat dissipation property. SOLUTION: A semiconductor element 110 is mounted on a high-heat conductivity metal plate 130 by die bonding, a tabular insulative spacer 140 and a lead frame 120 are laminated in the order of these of the spacer 140 and the frame 120 on the plate 130 in such a way as to encircle this element 110 and the point regions of inner leads 121 and the surfaces of outer terminals 122 are made to expose on the upper surface of this lead frame 120 to seal lead members with an organic insulating layer 150. The inner leads 121 and terminals of the element 110 are electrically connected with each other through wires 180. External electrodes 170, which consist of solder balls, are formed on the surfaces of the terminals 122, which are exposed from the layer 150, of the lead frame 120 in such a way that each one part of the electrodes 170 is exposed from the layer 150 and the peripheral part of the element 110 is sealed with a sealing resin 190 including the wires and the point regions of the inner leads 121.</p> |
