| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce operations for position adjusting between tape automated bonding (TAB) and a probe and to shorten index time. SOLUTION: At every timing when TAB 1 having IC chips and position adjusting standard marks being aligned at a constant interval is orderly transferred, TAB 1 is made to approach a corrected position 1F near a probe 12. At the said position an image data of TAB 1 is taken by a camera 15, correction of relative position between the probe 12A and TAB 1 based on the said image data is made and after the correction TAB 1 is contacted with the probe 12A. During the operation of TAB 1 being approached to the probe, focus adjusting is made to be easy by the camera 15 being made to follow TAB 1 transfer by a block 15B, a ball screw 15C and a motor 15D.</p> |
