| 摘要 |
<p>PROBLEM TO BE SOLVED: To correct the amount of cutting by the abrasion of a blade by a method in which after the recessing of a material to be processed the distance in the diameter direction from a prescribed position to the peripheral end of the blade is measured again, and the amount of abrasion of the blade is detected from the results of measurements before and after the recessing. SOLUTION: For the recessing of a material to be processed such as a semiconductor wafer, a controller 10 rotates a blade 5 by a spindle 6 and transfers it by a set amount in the cutting direction by a precision table 8. After processing for a given time, the controller 10 returns the spindle 6 to a prescribed position by the precision table 8, again transfers a continuity sensor 2 toward the peripheral end of the blade 5 by the precision table 4, and operates the amount of transfer from a prescribed position of the continuity sensor 2 to the peripheral end of the blade 5. In this process, the amount of abrasion of the blade is obtained from the difference between the operation results before and after the processing. The amount of cutting can be kept constant by the correction for the abrasion of the blade 5.</p> |
