Packaged semiconductor device and a manufacturing process therefor

摘要

A semiconductor device accommodated in a package includes a semiconductor chip (35), a package body (32) for accommodating the semiconductor chip, and a plurality of terminal members (33) embedded in the package body in electrical connection to the semiconductor chip and projecting from a bottom surface of the package body, wherein each of said terminal members has a shape such that the terminal members roll substantially freely when placed on a flat surface.