HIGH HEAT SINK PACKAGE

摘要

A semiconductor package for emitting heat is described that can be applicable to ASICs having a high frequency characteristic or a semiconductor memory device requiring a high speed. The semiconductor package is provided with at least one semiconductor chip equipped over a substrate, bonding means for electrically connect the semiconductor chip to the substrate, heat emitting means which include the heat spreader equipped over the semiconductor chip by insulating bond and having a high thermal conduction, and the thermal compound covered upon the heat spreader, and a metal cap formed over the entire substrate in order to proctect a semiconductor device. Thereby, it is possible to provide various types of thermal conduction means for effectively emitting the heat generated when the device is operated, an thus improve the reliability in the emiconductor memory device.