| 摘要 |
PURPOSE:To provide a part package method which enables mounting of a part on a printed substrate in a short time by using thermosetting resin and can prevent conductive adhesive which is attached to a bump from flowing out regarding a method of a part package using adhesive. CONSTITUTION:A part 2 and a printed substrate 1 are adhered by an insulating adhesive A interposed between the part 2 and the printed substrate 1. In a part package method which provides conductivity by a conductive adhesive B interposed between a bump 21 of the part 2 and a pad 11 formed on the printed substrate 1, after the thermosetting conductive adhesive B transcribed on the bump 21 of the part 2 is heated in advance to be semihardened, the part 2 is heated and pressurized on the printed substrate 1 for thermally setting the insulating adhesive A arranged in a part package position on the printed substrate 1 and the conductive adhesive B transcribed on the bump 21. |
