发明名称 |
Semiconductor module with two metal connections on substrate |
摘要 |
On the semiconductor substrate (1) are formed two metal connections (2a,b) covered by a deposited silicon oxide film (4), filling the space between the connections. The chemical formula of the silicon oxide film contains an Si-F compound. Pref. the chemical formula of the silicon oxide comprises a unit with two silicon atoms bound together by an oxygen atom. The first silicon atom also binds three oxygen atoms, while the second silicon atom binds one to three fluor atoms.
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申请公布号 |
DE19612450(A1) |
申请公布日期 |
1997.04.24 |
申请号 |
DE1996112450 |
申请日期 |
1996.03.28 |
申请人 |
MITSUBISHI DENKI K.K., TOKIO/TOKYO, JP |
发明人 |
MATSUURA, MASAZUMI, TOKIO/TOKYO, JP |
分类号 |
H01L21/31;H01L21/316;H01L21/768;H01L23/522;H01L23/532;(IPC1-7):H01L21/316;H01L21/320 |
主分类号 |
H01L21/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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