发明名称 WIRING PATTERN DESIGN METHOD, WIRING PATTERN DESIGN DEVICE AND MANUFACTURE OF MULTILAYER WIRING SUBSTRATE
摘要 <p>PROBLEM TO BE SOLVED: To automatically design a wiring pattern which is excellent in an electric characteristic with high wiring ratio. SOLUTION: The pair of signal layers are defined 11. The relative up and down relation to prevent the short-circuit of the through hole of an upper surface and a lower surface is determined for every connection section 12. This up and down relation is determined by defining the connection section of the terminal of the upper surface of two interfering terminals as the upper side and the connection section of the terminal of the lower surface as the lower side. The connection section on the upper side is wired by the upper layer pairs than the connection section of the lower side. To perform wiring by keeping the this up and down relation, at first, after the uppermost layer pair is selected 13 and the connection section in which higher rank unwired connection section does not exist is extracted 14, the connection sections are wired by the layer pair 15. Successively, by defining the lower layer pair as a processing object 16, the same wiring trial is performed 13 to 15. Finally, the rewiring for which all the signal layers are used is performed for the remaining unwired connection section.</p>
申请公布号 JPH09114876(A) 申请公布日期 1997.05.02
申请号 JP19950270018 申请日期 1995.10.18
申请人 HITACHI LTD 发明人 SEKIYAMA YUTAKA;FUJIWARA YASUYUKI;KAZAMA KIYONORI
分类号 H05K3/00;G06F17/50;H05K3/46;(IPC1-7):G06F17/50 主分类号 H05K3/00
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