发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
摘要 PROBLEM TO BE SOLVED: To suppress a leak current in a semiconductor integrated circuit device formed on a semiconductor substrate having an input protection circuit element such as a diode formed thereon. SOLUTION: An N type MOS 9b and a P type MOS 9b are formed to be a single crystalline silicon layer of an SOI(silicon on insulator) type, and an N type diffusion layer 18 and a P type diffusion layer 19 are formed in a semiconductor substrate 1 to form a protective diode 17 which forms an input protection circuit of a CMOS inverter circuit 13 The N type diffusion layer 18 is surrounded by the P type diffusion layer 19 so that the P type diffusion layer 19 cuts off a depletion layer formed at an interface of an embedded insulating film 2 within the semiconductor substrate 1, thereby suppressing a leak current between the P and N type diffusion layers 18 and 19.
申请公布号 JPH09115999(A) 申请公布日期 1997.05.02
申请号 JP19950274433 申请日期 1995.10.23
申请人 DENSO CORP 发明人 SUZUKI YOSHIMI;ASAI SHOKI;SAKAKIBARA JUN
分类号 H01L21/761;H01L21/822;H01L21/8238;H01L27/04;H01L27/06;H01L27/092;H01L27/12;H01L29/786;(IPC1-7):H01L21/761;H01L21/823 主分类号 H01L21/761
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