| 摘要 |
The socket for use of a bottom leaded package test is constructed by a socket body(11) having an element mounting part(11a) formed by a cave-in part of a given size, a closure(13) hinge-combined with the socket body(11) so as to be rotated and opened/closed, the closure(13) being for pressing an element for the sake of its support, a plurality of contact pins(14) compressedly combined with both sides of the element mounting part(11a) of the socket body(11) so as to form an electric connection path of a test substrate and a lead on a lower face of the element, and an elastic pin(18) fit into a locking part for maintaining a combination state of the socket body(11) and the closure(13), and into a hinge pin(12) of the closure(13), for elastically supporting the closure(13) in its opening direction, whereby effectuating in testing very easily the bottom leaded package currently under a practical use.
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