| 摘要 |
PROBLEM TO BE SOLVED: To execute the take out and housing of a wafer nearly at the same time to greatly reduce the wafer conveying time by driving a first arm member to take out wafers and second arm member to house them independently with respect to height direction. SOLUTION: Wafers are taken out for specified treatments from a cassette member housing them. At the end of specified treatments they are taken out and housed in the cassette member. A first arm member 11 to take out the wafers is at specified distance in height direction from a second member 12 to house them and both members are driven by driving means 16 and 17 independently with respect to height direction. This allows the take out and housing of the wafers to be done near at the same time, thereby greatly reducing the wafer conveying time. |
