HOT-MELT ADHESIVE COMPOSITION

摘要

Novel hot melt adhesive composition containing ethylene-ethylacrylate copolymer resin and/or ethylene-acrylic acid copolymer resin which has good heat-resistance and initiative adhesion is disclosed in this invention. Above-described hot melt adhesive composition is composed of 40-75 wt % of ethylene-ethyleneacrylate copolymer resin containing 8-23 wt % of ethylacrylate, ethylene-acrylic acid copolymer resin containing 3-5 wt % of acrylic acid and 5-10 wt % of butylacrylate or mixture thereof, 20-5 wt % of synthesized rubber and 40-20 wt % of resin. Adhesive composition in this invention optionally contains wax.