| 摘要 |
PROBLEM TO BE SOLVED: To improve the flatness of a semiconductor device to the packaging surface of a package substrate while enhancing the reliability of the semiconductor device upon heating. SOLUTION: Within a semiconductor device wherein the outer terminals 1A on the main surface of a wiring substrate 1 made of a resin substrate and the other outer terminal 2A on the major surface of a semiconductor pellet 2 are fixed to one another, bump electrodes 3 are arranged on the peripheral region of a major surface of the semiconductor chip 2 while an aperture part 1C is provided in the region opposite to the central region on the major surface of the semiconductor chip 2. Furthermore, the gap region between the wiring substrate 1 and the semiconductor chip 2 is filled up with resin 4 passing through the aperture part 1C of the wiring substrate 1. |
