Electronic module with circuit on substrate surface

摘要

The substrate (10) located circuit (20) comprises semiconductor components (21,22), ON the substrate is formed a high heat conductivity support (30), between which and the substrate opposite surface is located a coupling layer (40) formed using a soldering matrix of high heat conductivity, consisting of a base component (41), additive component (42) distribute in the base one, and additive material. The coupling layer is deposited on the substrate and/or the support. TH additive component consists of numerous balls with less than the coupling layer thickness.