| 摘要 |
PROBLEM TO BE SOLVED: To obtain a product of high quality and high reliability by injecting and packing a molten resin material under uniform injection pressure at uniform injection speed nearly simultaneously into a mold cavity in which an electronic part which is set in a lead frame is engaged and set. SOLUTION: Resin tablets R are supplied into the pots 30 of a mold, heated, and melted, the molten resin material is supplied into mold cylinders 50 by plungers 40 which are engaged into the pots 30 of the mold respectively, and by pressurizing the molten resin material (T) in the cylinders 50 uniformly by pistons 90 which are engaged into the cylinders 50 freely reciprocatingly slidably, respectively, the material (T) is injected and packed into a mold cavities 70 respectively under uniform injection pressure at uniform injection speed nearly simultaneously. |
