| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink mounted on a semiconductor device and capable of improving efficiency in heat radiation. SOLUTION: A structure of a heat sink for a semiconductor device is made up of a group of fins 1 and a ventilation fan. The group of fins 1 is made up of a plurality of plates or pins arranged vertically on a base. The ventilation fan is made up of a fan rotating mechanism and a centrifugal fan 2. The group of fins 1 and the centrifugal fan 2 have a cover 3. The cover 3 has an air inlet opening 5 in a rotating direction of the centrifugal fan 2. In this way, the centrifugal fan 2 is used, instead of an axial fan in a conventional way, and the heat sink and the fan have the cover 3 for preventing air flowing outside. The air inlet opening 5 is provided on the side face of the fan cover 3. As a result, the heat sink and an electronic part using the heat sink are made small with good efficiency in radiation. |
