| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a power semiconductor module device which enables reduction in cost for storage and mounting on the drive side. SOLUTION: A power semiconductor module device has a plurality of forms of power semiconductor modules 310. Each module has one or more controllable power semiconductors 36 and 37, and is housed together with externally connected power connectors 313-317 and a control connector within a module housing 311. A driving unit 325 for each module 310 is housed in an isolated housing 334 and is removably connected with an associated semiconductor module. Thus, a driving signal passed at an appropriate control signal output from the driving unit 325 is supplied to the control connector corresponding to the module. The control connector of the module 310 is arranged as a three- dimensional structure at each first fixed position. The control signal output of the driving unit 325 is arranged as a three-dimensional structure at a second fixed position overlapped on each first structure. |
