| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board in which several groups of pattern connection between layers are connected by a single through hole and to provide its manufacturing method. SOLUTION: Copper foils 11 and 20 and double-sided boards 14 and 17 on which patterns are provided are laminated sandwiching pre-pregs 12, 13, 15, 16, 18 and 19. After through holes are made, the multilayer board is immersed into an electroless copper plating liquid. Since the palladium contained in the pre-pregs acts as a self-catalyst, copper is deposited on a part of the wall of the through holes on which the pre-preg is exposed. Layers made of copper deposited in this way such as layers M2 1, M22 and M23 can selectively connect patterns 11 and P13, patterns P16 and P22, and patterns P24 and 20 respectively. |
