MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a device allowing a stable set-up of a composition of solder bumps to be made connecting media at the time of a flip-chip connection. SOLUTION: Bump electrodes 161, 162,... consisting of a Pb-Sn alloy respectively are formed on in-and output pads 151, 152,... to be formed on a mounting substrate 14 and also the bump electrodes 131, 132,... are formed on in-and output pads 121, 122,... of semiconductor elements 11 only by means of Sn which is one component of the Pb-Sn. Then, the bump electrodes 161, 162,... respectively and the bump electrodes 131, 132,... respectively are temporarily stopped and to reflow so as to flip-chip connected the mounting substrate 14 and the semiconductor element 11. At the time of forming the bump electrodes 131, 132,... of the semiconductor element 11, a composition of the solder bumps after the flip-flop connection requires no consideration.