Test unit for testing unencapsulated semiconductor integrated circuit

摘要

The test unit has a main frame (40) with a horizontally extended case. Two wafer test head units (10) are arranged side by side at right angles to the main frame. A rotational drive unit (30) with two drive shafts is provided. The test heads (20) are respectively connected to the drive shafts. The main frame has a height (H1) which approximates to that of the wafer test head units (10). The test head (20) is moved by the drive unit from a first position to a second position, so that a surface of the test head, exposed to the contact unit (21) is turned upwards. The extension of the top section of the rotational drive unit is arranged on the top side of the main frame. The rotational drive serves for the rotational drive of the two test heads (20), connected with the drive shafts. The test heads are movable between a first position, lying opposite a contact section and a second position, above the top side of the main frame.