发明名称 ELECTRODE FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To form a thermally stable TiAs layer on the interface of a gate electrode and a GaAs substrate in the manufacture of a GaAs FET. SOLUTION: A Schottky electrode is characteristically formed as follows. A Ti layer is formed on a GaAS surface 1, a TiAs compound 22 is formed by conducting heat treatment in an As atmosphere, and an Al layer 3 is deposited on the TiAs compound 22. Also, As is injected into the expected region for formation of a Schottky electrode on the surface of GaSa, and after a Ti layer 21 and an Al layer 23 have been laminated on the expected region for formation of a Schottky electrode, a TiAs compound 22 is formed by conducting heat treatment. Besides, a Schottky electrode is formed on GaSa-IC using either of the above-mentioned forming methods.
申请公布号 JPH09232600(A) 申请公布日期 1997.09.05
申请号 JP19960035965 申请日期 1996.02.23
申请人 TOSHIBA CORP 发明人 TAKAGI KAZUNARU
分类号 H01L29/41;H01L21/338;H01L29/47;H01L29/812;H01L29/872;(IPC1-7):H01L29/872 主分类号 H01L29/41
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