MATERIAL FOR MULTILAYER WIRING BOARD, MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD OF MULTILAYER WIRING BOARD, USING IT

摘要

PROBLEM TO BE SOLVED: To simultaneously execute the lamination of layers into a multilayer structure and electrical connection between the layers, and provide a high densi ty and thin sheet-like material. SOLUTION: A multilayer wiring board material has an insulative adhesive layer on one side of a metal foil and peelable org. film laminated on the surface of the adhesive layer. A laser beam is irradiated on the org. film to form blind holes reaching the metal foil for electric interconnection between layers. A conductive paste is filled in the blind holes and half hardened. The org. film is peeled off, the formed material is positioned and laminated on a wiring board having an inner layer circuit with the metal foil outside and hot pressed into a unified board. It is etched to form a conductor pattern with the outer metal foil, and above steps are repeated to form a multilayer board.