| 摘要 |
PROBLEM TO BE SOLVED: To provide a stripping jig which does not damage adhered surfaces and prevents the adhesion of particles in the case voids are generated in the adhesive boundary after adhesion and the adhered surfaces are once stripped of the purpose of reahesion in production of stuck SOI wafers. SOLUTION: The stripping jig 1 has a wedge-shaped part 1a to be press fitted into the adhered surfaces and plane parts 1b disposed on both sides of the base part of the wedge-shaped part 1a. The vertexθof the wedge-shaped part 1a is so set as to attainθ>α+βwhen the chamfering angles on the adhered surface side of the supporting substrate 3 of the adhered wafer 2 and active wafer 4 to be separated are respectively defined asαandβ. When the wedge-shaped part 1a is press fitted into the adhered surfaces, the right and left slopes of the wedge-shaped part 1a come into contact with the outside edges A, B of the chamfered parts 3a, 4a and flare the chamfered parts 3a, 4a. Then, the wedge-shaped part 1a does not come into contact with the adhered surfaces and the adhered wafer 2 is separated from the adhered surfaces until the plane parts 1b, 1b come into contact with the outer edges of the adhered wafer 2. |
