| 摘要 |
PROBLEM TO BE SOLVED: To provide a single in line package having the erectness and the self-standing strength. SOLUTION: Within a semiconductor device wherein a plurality of planar leads 2, 3, 4 are led out of one end of a package 1 in the same direction, at least both end leads 2, 4 out of these leads 2, 3, 4 are bent in the opposite directions along respective adjacent ends to be arranged so that the planes of these bent leads 2, 4 may be made rectangular with the plane of not bent residual lead 3. Furthermore, respective leads 2, 3, 4 are led out to extennd in the same direction. |
