发明名称 FLAME-RETARDANT CYANIC ESTER RESIN COMPOSITION AND COPPER-CLAD LAMINATE
摘要 PROBLEM TO BE SOLVED: To obtain a flame-retardant cyanic ester resin compsn. which, when cured alone, exhibits an improved resistance to soldering heat after moisture absorption by compounding a polyfunctional cyanic ester resin with a specified amt. of a specific epoxy resin. SOLUTION: This compsn. essentially comprises 20-60 pts.wt. polyfunctional cyanic ester resin having at least two OCN groups or its prepolymer (A), 5-50 pts.wt. novolak-type glycidyl ether represented by formula I (wherein Gly is a group represented by formula II; (n) is 0-10; (m) is 1-4; and R is H or a 1-4C alkyl) (B), and 10-40 pts.wt. glycidyl ether of tetrabromobisphenol A (C). An example of ingredient A is represented by formula III, and that of ingredient B, by formula IV. A prepreg is laminated to a copper foil by using the compsn. and thermoformed, thus giving a copper-clad laminate esp. useful for a printed circuit board.
申请公布号 JPH09278882(A) 申请公布日期 1997.10.28
申请号 JP19960090968 申请日期 1996.04.12
申请人 SUMITOMO CHEM CO LTD 发明人 HAYASHI TOSHIAKI
分类号 C08L79/00;C08G59/46;C08G73/00;C08L63/00;H01B5/14;H05K1/03;H05K3/46;(IPC1-7):C08G73/00 主分类号 C08L79/00
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