| 摘要 |
<p>PROBLEM TO BE SOLVED: To detach a wafer without damaging it, by providing a through hole which supplies gas to a gap part with a specific depth on the clamping surface of an insulated substrate, and by projecting a lift pin to push and detach the wafer which is held on the wafer table when gas pressure which is detected by a detecting means provided in the through hole seaches a predetermined value. SOLUTION: An upper surface of an insulated board 2 is made to be a wafer table 5, an opening gap part 8 with 50∼200μm depth being comprised of a gap 8a having a concentric circle form and a gap 8b extending with a radiating form from the center are formed on the wafer table 5 and a through hole 9 to supply such gas as He and so on to the gap part 8 is provided. A pressure sensor 12 is provided as a detecting means to detect gas pressure change in the through hole 9 and a lift pin 7 is projected to push and detach a wafer 30 held on the wafer table 5 when the gas pressure reaches a predetermined value measured by the pressure sensor 12. This can detach the wafer 30 without damage.</p> |
