| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a resin-sealed semiconductor device of a BGA type, and a lead frame member used therein, which is corresponding to a multi-terminal format, production- and cost-advantageous, and excellent in quality, and to provide a manufacturing method of the lead frame member. SOLUTION: The semiconductor device comprises a lead frame 110, including inner leads 112 and external terminal members 113 for connecting an external circuit, having a part thinner than that of its material, and an insulating resin 120 which fixes the entire device. The lead frame 110 is formed by a two-step etching process, and the insulating resin 120 is formed by using an etching resistant layer in the etching process. The insulating resin 120 and the lead frame 110 form a plane along the material surface without any gap, and have a plural separate pairs of external terminal members 113 and the inner leads 112, integrated to engage with each other in close contact. The external terminal members 113 respectively have a surface, connecting to the external circuit, forming the flat surface, and exposed toward the outside.</p> |
