| 摘要 |
Gold alloys are disclosed containing yttrium, calcium, beryllium and lead as additives in the ratio of yttrium: calcium: beryllium: lead = 1: 0.5 to 2.0 : 0.1 to 1.0 : 0.1 to 1.0, preferably 1 : 0.7 to 1.5 : 0.2 to 0.6 : 0.1 to 0.5. The yttrium content is at least 5 ppm by weight, preferably 10 to 30 ppm. The total content of said additives is 80 ppm or less by weight, preferably 20 to 60 ppm, the balance being inevitable impurities and gold. The head resistance and the strengths of such alloys at normal and high temperatures are improved and the splicing loop height can be reduced. Also the influence of the wire flow due to the sealing resin is negligible, and the shape of the ball is favourable, so that the reliable splicing can be achieved. |
