| 发明名称 |
LEAD-FREE, TIN, ANTIMONY, BISMTUH, COPPER SOLDER ALLOY |
| 摘要 |
Disclosed is a high solidus temperature, high service temperature, high strength multi-component solder alloy having a major portion of Sn and effective amounts of Sb, Bi and Cu. |
| 申请公布号 |
KR0124517(B1) |
申请公布日期 |
1997.12.26 |
| 申请号 |
KR19940011744 |
申请日期 |
1994.05.28 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORP. |
发明人 |
GONYA, STEPHEN GILBERT;LAKE, JAMES KENNETH;LONG RANDLY CLINTON;WILD, ROGER CLINTON |
| 分类号 |
B23K35/26;C22C13/02;H01L21/60;H01L23/488;H05K3/34 |
主分类号 |
B23K35/26 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
