| 摘要 |
<p>The present invention provides for a semiconductor workpiece processing tool (10) and methods for handling semiconductor workpiece therein. The semiconductor workpiece processing tool (10) preferably includes an interface section (12) comprising at least one interface module (38, 39) and a processing section (14) comprising a plurality of processing modules (20, 22, 24) for processing the semiconductor workpieces (W). The semiconductor workpiece processing tool may have a conveyor (60) for transferring the semiconductor workpieces between the interface modules (38, 39) and the processing modules (20, 22, 24).</p> |
