| 摘要 |
PROBLEM TO BE SOLVED: To facilitate operation in multi-layer pressing by coating a flexible circuit board with solder resist and setting the resist, then coating a circuit surface of a rigid circuit board with adhesive and semi-setting the adhesive, arranging the adhesive-coated surface on the solder-resist coated surface, and heat-pressing the surfaces. SOLUTION: A flexible circuit board (a) is constructed by forming a circuit on a flexible board, both surfaces of which are laminated with copper, and solder resist for flexible circuit board is printed and set, to obtain a flexible circuit board (b) with the solder resist. A rigid circuit board (c) is obtained by forming a single-side circuit on a copper foil of a double-side glass epoxy- resin copper-laminated board, where both surfaces of a prepreg, obtained by soaking a glass cloth with epoxy resin and setting the glass cloth, are laminated with copper foils. A rigid circuit board (e) with adhesive is obtained by printing adhesive (d) on the circuit surface of the rigid circuit board (c) drying the adhesive d to semi-set the adhesive. The flexible and rigid circuit boards are overlapped and heat-pressed. By controlling the semi-set condition of the adhesive, operation in pressing can be simplified. |
