| 摘要 |
PROBLEM TO BE SOLVED: To provide a thick film pattern forming method capable of obtaining a highly accurate pattern in a simple process. SOLUTION: A pattern forming layer 12 is formed by applying photosensitive paste to the surface of a film 11, and the film 11 is laminated on a glass substrate 13 so that the pattern forming layer 12 is faced to the glass substrate 13. The pattern forming layer 12 is exposed from the upper part of the film 11 through a mask M, the film 11 is peeled off, the layer 12 is developed, a non-exposed part 12a is removed, and the layer 12 is baked to obtain a pattern 14. When the pattern forming layer 12 is not sticky, the film 11 is peeled off, then exposure may be performed. In order to expose the pattern forming layer 12 after positioning on the substrate 13, a process is simplified, and the pattern with uniform film thickness can be formed. |
