| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to conduct a hardly deformed bonding operation by preventing the softening of an insulating pad by heat when it is bonded. SOLUTION: Conductive inner bumps 12 are formed on an insulation substrate 11. Circuit patterns 14 are electrically connected to the bumps 12 and it is fixed to the insulation substrate 11. A chip component 15 is electrically connected to the circuit pattern 14 through bumps 16. Accordingly, the strength against the pressure when the chip component 15 is pressure-welded is increased by internally packing the bumps 12 to the insulation substrate 11 positioned on the circuit pattern 14 where the chip component 15 is connected, and the deformation of the pad part when it is bonded can be prevented. |
