发明名称 STRUCTURE FOR GROUNDING HIGH-FREQUENCY CIRCUIT SUBSTRATE AND RADIO WAVE SHIELDING
摘要 <p>PROBLEM TO BE SOLVED: To with a simple constitution a structure for grounding a high-frequency circuit substrate and a radio wave shielding, which enables sure grounding of the high-frequency circuit substrate and the radio wave shielding. SOLUTION: A metal box body 1, a high-frequency circuit substrate 2 mounted in the metal box body 1 and a shielding frame 3 which, together with the metal box body 1, holds the high-frequency circuit substrate 2 in between and covers it are provided to a structure for grounding a high-frequency circuit substrate and a radio wave shielding, which is provided with a recessed part provided to a part of a surface mounted with the substrate of the metal box body 1 and an elastic body 7 inserted into the recessed part. By attaching the shielding frame 3, the elastic force of the elastic body 7 acts, so that a grounding surface of a circuit-formed surface of the high-frequency circuit substrate 2 adheres tightly to the bottom part of a partition wall 6 of the shielding frame 3, for grounding and radio wave shielding.</p>
申请公布号 JPH10107476(A) 申请公布日期 1998.04.24
申请号 JP19960277183 申请日期 1996.09.27
申请人 NEW JAPAN RADIO CO LTD 发明人 MORI KAZUHIRO;INOUE YOSHIHARU
分类号 H05K9/00;(IPC1-7):H05K9/00 主分类号 H05K9/00
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