| 摘要 |
<p>A process for fabricating a multiplicity of semiconductor devices comprises the steps of applying electrodes (14', 16') to both faces of a semiconductor wafer, and mounting the semiconductor wafer to a substrate (18) by means of an intervening layer of wax (20) which bonds to the substrate and to the wafer. The wafer is then divided by grooves which extend through the wafer and at least partially through the layer of wax. The grooves are filled with a flexible resin (28) that bonds to and passivates the edges of the chips, and the resin is subsequently cured. Next, the wax is removed from the cured resin and chips to provide a discrete flexible unit separate from the substrate. The discrete unit is divided into cells, each of which includes one of the chips for subsequent fabrication into a completed semiconductor device.</p> |
