| 摘要 |
PROBLEM TO BE SOLVED: To enable correction and repair of defects in a thin-film multilayer wiring board. SOLUTION: Within a method of correcting and repairing thin-film multilayer wiring board forming contact holes, wherein a multilayer 8 is coated with a positive-type resist to be irradiated with ultraviolet rays 17, using a photomask 16 for removing the resist in the irradiated parts, if defect or foreign matter is detected in the insulating layer (multilayer film) 8, the insulating layer 8 is coated with negative-type resist 21 in characteristic inverse to the former resist to make alignment with the photomask 16 for irradiating the layer 8 with the ultraviolet rays 17 for removing the negative-type resist in the unirradiated part with the ultraviolet rays. Thus protecting films 11 may be formed on the contact holes for removing the insulating film 8 in the protected state by the protecting films 11 for correcting or repairing the defect or foreign matters. |
