POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND MANUFACTURE OF LARGE SCALE INTEGRATED CIRCUIT BY USING SAME

摘要

PROBLEM TO BE SOLVED: To provide the positive photosensitive resin composition easy in development and superior in heat resistance and capable of forming a fin tough relief pattern with small residue by incorporating a specified cresol novolak resin. SOLUTION: The photosensitive resin composition contains 1-100 pts.wt. of a diazoquinone compound having repeating units each represented by the formula and 1-30 pts.wt. of the cresol novolak resin per 100 pts.wt. of the resin components. In the formula, A is a tetravalent organic group having >=4 C tetracarboxylic acids or their derivative; each of R<1> and R<2> is, independently, an H atom or a <=20 C aliphatic carboxy group and at least one of them is not an H atom; and R<3> is a divalent organic diamine group. The cresol novolak resin can be embodied by the ones generally used for the positive photoresists.