| 摘要 |
<p>PROBLEM TO BE SOLVED: To simplify a process by releasing and separating semiconductor elements that are separated from each other from an adhesive sheet that they carry, while they are opposed in an active region, correcting positions and directions, transferring and positioning an active region formation surface opposingly to the lead frame where an adhesion junction is preheated, and then performing crimping and fixing. SOLUTION: An active region surface A' on a backup holder 16 is adhered and carried onto an adhesive sheet 15, a wafer where semiconductor elements 3a' are cut and separated is pushed up by a pin 17 that projects onto a pin holder 19 without damaging the adhesive sheet 15, the semiconductor element 3a' is separated from the adhesive sheet 15 and at the same time is sucked and carried by a pickup collet 11a, and is transferred to a position correction stage, thus correcting positions and directions. Then, the semiconductor elements 3a are supplied to the installation region of a die bonding head 8 by a pickup head 11 and are allowed to oppose, and are aligned to a lead frame being carried with a die bonding part 16 were a liquid adhesive layer 20 is provided at an upper side for contact bonding. At this time, the adhesive layer 20 of the lead frame is locally heated by a heater 22 that is incorporated in a pressurization block 21.</p> |
