发明名称 Monoblock structure consisting of stacked components
摘要 <p>The structure includes one end of at least one first track (10-11, 20-21, 30-31, 40-41, 50-51) on each layer being connected to the component (1-5) on that layer with the other end being connected to one end of at least one second track to the side (F2, F3). The third tracks are connected to the second tracks at points around the perimeter of a separate board (6). The third tracks are connected to input and output pins (80, 81, 82) in metallised holes in the separate board. This may be part of a waveguide with an earthing pin on one edge coupled by the third track. The whole monoblock is encased in insulation (D) such as a hard resin.</p>
申请公布号 EP0858108(A1) 申请公布日期 1998.08.12
申请号 EP19980400273 申请日期 1998.02.09
申请人 ALCATEL 发明人 DREVON, CLAUDE
分类号 H01L25/18;H01L21/98;H01L25/065;H01L25/07;H01L25/10;H05K1/14;(IPC1-7):H01L25/10 主分类号 H01L25/18
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