发明名称 COPPER ALLOY FOR SEMICONDUCTOR LEAD FRAME
摘要 PROBLEM TO BE SOLVED: To improve the strength, electric conductivity, bendability, punchability, stress corrosion cracking-resistance and producibility of a copper alloy by specifying the compsn. and grain size in a Cu-Zn-Sn alloy. SOLUTION: This alloy is composed of by weight, 10 to 35% Zn, 0.1 to 2.0% Sn, and the balance Cu with inevitable impurities and having 5 to 35μm grain size. Preferably, this compsn. is added with one or >= two kinds selected from the groups of Pb, Bi, Se, Te, Cu, Sr and misch metal by 0.001 to 0.5% in total. More preferably, it is furthermore added with one or two kinds selected from the groups of Ni, Si, Cr, Zr, Fe, co, Mn, Al, Ag and Mg by 0.001 to 1.0% in total. This alloy is subjected to high frequency melting and is thereafter cast to form into an ingot at a cooling rate of 6 deg.C/sec, which is subsequently subjected to hot rolling at 850 deg.C. After that, it is subjected to cold rolling, is annealed at 530 deg.C in an inert gas atmosphere and is successively subjected to cold rolling once more to form into a sheet material having desired thickness.
申请公布号 JPH10280072(A) 申请公布日期 1998.10.20
申请号 JP19970083761 申请日期 1997.04.02
申请人 FURUKAWA ELECTRIC CO LTD:THE;SHINKO ELECTRIC IND CO LTD 发明人 KURIHARA MASAAKI;EGUCHI TATSUHIKO;HIRAI TAKAO
分类号 C22C9/04;H01L23/48;(IPC1-7):C22C9/04 主分类号 C22C9/04
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